However, recent developments suggest that MediaTek is gearing up to introduce a flagship System-on-Chip (SoC) that could surpass its Qualcomm counterpart. The Dimensity 9300 is expected to feature four high-performance Cortex-X4 cores, whereas the Snapdragon 8 Gen 3 is speculated to incorporate only two Cortex X4 prime cores, unrelated to MediaTek’s offering.
The presence of two prime cores already raises concerns regarding thermal management. Therefore, it will be intriguing to witness how MediaTek addresses the potential heat generated by its impressive four prime cores. If executed effectively, this could result in MediaTek’s Dimensity 9300 giving Qualcomm’s Snapdragon 8 Gen 3 a tough competition in terms of performance benchmarks.
Renowned Chinese tipster Digital Chat Station (DCS) shared this information, revealing that the Dimensity 9300 would adopt a 4+4 configuration, with the cores being referred to as “hunter.” These new Hunter Cortex X4 cores are likely to be ARM’s Cortex-A720 CPU cores, which have yet to be officially announced.
Regarding the energy-efficient Cortex-A5XX cores within the chip, DCS suggests that they will be named “hayes.” The chip itself will be based on TSMC’s enhanced N4P node, representing the company’s refined 4nm process.
However, despite the advancements in the manufacturing process, managing thermals with four prime cores operating at full capacity will pose a challenge. While MediaTek may be able to control the situation in a controlled environment, it remains to be seen how the Dimensity 9300 performs under various weather conditions and extreme stress scenarios.